Specification
Form Factor
M.2 2280
Interface
PCIe Gen3x4
Performance
256GB —sequential read up to 3300MB/s, write up to 1400MB/s
Operating Temperature
0°C to 70°C (32°F to 158°F)
Storage Temperature
-40°C to 85°C (-40°F to 185°F)
Dimension (L x W x H)
80 mm x 22 mm x 2.25 mm / 3.15” x 0.87” x 0.09”
Weight
9g
Shock Resistant
1500 G, duration 0.5ms, Half Sine Wave
Vibration Resistant
10~2000Hz, 1.5mm, 20 G, 1 Oct/min, 30min/axis(X,Y,Z)
TBW
1 TB: 500 TB, 512 GB: 250 TB,, 256 GB: 125 TB
DWPD
1 TB: 0.44, 512 GB: 0.44, 256 GB: 0.44
NAND flash
3D TLC
MTBF
1,500,000 Hours
1 Up to 3300MB/s read transfer, write transfer speeds lower. Speeds based on internal testing. Actual performance may vary.
2Shock resistant (1500G, duration 0.5ms, Half Sine Wave) and vibration resistant (10~2000Hz, 1.5mm, 20G, 1 Oct/min, 30min/axis(X,Y,Z)). Based on internal testing. Actual performance may vary.
3Comparison based on internal testing. Actual performance may vary.
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